Opto-mechanical design and high-frequency testing of a photodetector assembly on an integrated optics chip

The project aims to develop an innovative assembly strategy for a 500-micron photodetector on a silicon chip and to characterize its performance at 10 GHz. The photodetector will be rotated 90 degrees on the substrate, micro-positioned to ensure alignment with the integrated optics waveguide, while also guaranteeing high-quality electrical contact with the silicon substrate. The goal is to achieve fast, low-cost, compact, and energy-efficient optical micro-switches.